SEMICONDUCTOR INDUSTRY ASSOCIATION for SEMICONDUCTOR INDUSTRY ASSOCIATION

Budget/Appropriations BUD

Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: SENATE; Energy, Dept of; Natl Science Foundation (NSF); Natl Institute of Standards & Technology (NIST); Defense, Dept of (DOD); HOUSE OF REPRESENTATIVES; Executive Office of the President (EOP)

Immigration IMM

Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.

Contacted: Executive Office of the President (EOP); HOUSE OF REPRESENTATIVES; SENATE; Homeland Security, Dept of (DHS)

Trade (domestic/foreign) TRD

Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors, and issues related to sectoral tariffs.

Contacted: Natl Economic Council (NEC); State, Dept of (DOS); SENATE; White House Office; Executive Office of the President (EOP); Natl Security Council (NSC); U.S. Trade Representative (USTR); U.S. Customs & Border Protection; Treasury, Dept of; Defense, Dept of (DOD); Commerce, Dept of (DOC); HOUSE OF REPRESENTATIVES

Defense DEF

Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.

Contacted: Defense, Dept of (DOD); HOUSE OF REPRESENTATIVES; Treasury, Dept of; State, Dept of (DOS); Executive Office of the President (EOP); Natl Security Council (NSC); Homeland Security, Dept of (DHS); White House Office; Commerce, Dept of (DOC); SENATE

Bills named: S. 1053 (119th), H.R. 1316 (119th), S. 744 (119th), S. 1705 (119th), H.R. 3447 (119th), H.R. 2246 (119th)

Environment/Superfund ENV

PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes. The Building Chips in America Act of 2023 (P.L. 118-105), reforms to the Toxic Substances Control Act (TSCA). HFC allocations and Technology Transfer Rule (TTR) under the AIM Act (P.L. 116-260).

Contacted: SENATE; White House Office; Environmental Protection Agency (EPA); General Services Administration (GSA); HOUSE OF REPRESENTATIVES; Bureau of Land Management (BLM); Executive Office of the President (EOP)

Science/Technology SCI

Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: HOUSE OF REPRESENTATIVES; Defense, Dept of (DOD); Office of Science & Technology Policy (OSTP); Energy, Dept of; Natl Science Foundation (NSF); Defense Advanced Research Projects Agency (DARPA); Natl Institute of Standards & Technology (NIST); SENATE; Executive Office of the President (EOP)

Telecommunications TEC

Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip Equip Act (draft bill, introduction pending).

Contacted: Commerce, Dept of (DOC); SENATE; HOUSE OF REPRESENTATIVES

Taxation/Internal Revenue Code TAX

American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.

Contacted: SENATE; HOUSE OF REPRESENTATIVES

Bills named: H.R. 802 (119th), H.R. 1990 (119th), H.R. 1 (119th), H.R. 3204 (119th), S. 199 (119th), H.R. 33 (119th)

Labor Issues/Antitrust/Workplace LBR

Technical education and work-based learning opportunities, opportunity and affordability in STEM and innovation, expansion of access to Pell Grants and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.

Contacted: Labor, Dept of (DOL); HOUSE OF REPRESENTATIVES; Natl Science Foundation (NSF); Commerce, Dept of (DOC); White House Office; SENATE