SEMICONDUCTOR INDUSTRY ASSOCIATION for SEMICONDUCTOR INDUSTRY ASSOCIATION

Budget/Appropriations BUD

Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: HOUSE OF REPRESENTATIVES; Energy, Dept of; Natl Science Foundation (NSF); Executive Office of the President (EOP); Defense, Dept of (DOD); SENATE; Natl Institute of Standards & Technology (NIST)

Immigration IMM

Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration.

Contacted: SENATE; Executive Office of the President (EOP); HOUSE OF REPRESENTATIVES

Trade (domestic/foreign) TRD

Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.

Contacted: U.S. Customs & Border Protection; HOUSE OF REPRESENTATIVES; U.S. Trade Representative (USTR); Natl Security Council (NSC); Executive Office of the President (EOP); Natl Economic Council (NEC); State, Dept of (DOS); White House Office; SENATE; Commerce, Dept of (DOC); Defense, Dept of (DOD); Treasury, Dept of

Defense DEF

Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (S. 2226, H.R. 2670) (export control, outbound investment, NEPA, other). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760).

Contacted: HOUSE OF REPRESENTATIVES; Natl Security Council (NSC); Commerce, Dept of (DOC); Defense, Dept of (DOD); State, Dept of (DOS); Executive Office of the President (EOP); SENATE; Homeland Security, Dept of (DHS); White House Office

Bills named: S. 2226 (118th), S. 2228 (118th), H.R. 2670 (118th), H.R. 4549 (118th), H.R. 760 (118th), S. 2678 (118th)

Environment/Superfund ENV

American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).

Contacted: SENATE; Executive Office of the President (EOP); Environmental Protection Agency (EPA); Bureau of Land Management (BLM); HOUSE OF REPRESENTATIVES; White House Office; General Services Administration (GSA)

Bills named: S. 2228 (118th), H.R. 4549 (118th)

Science/Technology SCI

Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: Natl Institute of Standards & Technology (NIST); HOUSE OF REPRESENTATIVES; Energy, Dept of; Executive Office of the President (EOP); SENATE; Natl Science Foundation (NSF); Defense Advanced Research Projects Agency (DARPA); Office of Science & Technology Policy (OSTP); Defense, Dept of (DOD)

Telecommunications TEC

Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).

Contacted: Commerce, Dept of (DOC); SENATE; HOUSE OF REPRESENTATIVES

Taxation/Internal Revenue Code TAX

American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.

Contacted: HOUSE OF REPRESENTATIVES; SENATE

Bills named: S. 866 (118th), H.R. 4729 (118th), S. 1457 (118th), H.R. 2673 (118th)

Labor Issues/Antitrust/Workplace LBR

Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).

Contacted: HOUSE OF REPRESENTATIVES; White House Office; SENATE; Commerce, Dept of (DOC)