SEMICONDUCTOR INDUSTRY ASSOCIATION for SEMICONDUCTOR INDUSTRY ASSOCIATION

Budget/Appropriations BUD

Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: SENATE; Executive Office of the President (EOP); HOUSE OF REPRESENTATIVES; Natl Institute of Standards & Technology (NIST); Defense, Dept of (DOD); Energy, Dept of; Natl Science Foundation (NSF)

Immigration IMM

Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.

Contacted: SENATE; Executive Office of the President (EOP); Homeland Security, Dept of (DHS); HOUSE OF REPRESENTATIVES

Trade (domestic/foreign) TRD

Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, including provisions in the House and Senate FY25 Commerce, Justice, Science, and Related Agencies Appropriations Bill reports and the FY25 National Defense Authorization Act (P.L. 118-159).

Contacted: Natl Security Council (NSC); Defense, Dept of (DOD); White House Office; State, Dept of (DOS); Treasury, Dept of; Executive Office of the President (EOP); HOUSE OF REPRESENTATIVES; Natl Economic Council (NEC); U.S. Trade Representative (USTR); SENATE; Commerce, Dept of (DOC); U.S. Customs & Border Protection

Defense DEF

Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (P.L. 118-105). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678) and the Comprehensive Outbound Investment National Security (COINS) Act (H.R. 10559). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Legislation related to semiconductor hardware security. Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.

Contacted: Commerce, Dept of (DOC); Defense, Dept of (DOD); White House Office; Homeland Security, Dept of (DHS); Treasury, Dept of; Executive Office of the President (EOP); Natl Security Council (NSC); State, Dept of (DOS); SENATE; HOUSE OF REPRESENTATIVES

Bills named: H.R. 8826 (118th), H.R. 7151 (118th), S. 4585 (118th), S. 2678 (118th), H.R. 760 (118th), H.R. 10559 (118th), H.R. 6606 (118th), H.R. 8315 (118th), H.R. 8152 (118th), H.R. 8924 (118th), H.R. 5613 (118th), H.R. 6614 (118th), H.R. 6602 (118th)

Environment/Superfund ENV

PFAS legislative and regulatory policy. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (P.L. 118-105).

Contacted: Environmental Protection Agency (EPA); White House Office; SENATE; Executive Office of the President (EOP); Bureau of Land Management (BLM); HOUSE OF REPRESENTATIVES; General Services Administration (GSA)

Science/Technology SCI

Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: Executive Office of the President (EOP); Office of Science & Technology Policy (OSTP); Defense Advanced Research Projects Agency (DARPA); Defense, Dept of (DOD); Natl Institute of Standards & Technology (NIST); SENATE; HOUSE OF REPRESENTATIVES; Natl Science Foundation (NSF); Energy, Dept of

Telecommunications TEC

Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).Spectrum and National Security Act of 2024 (S. 4207).

Contacted: HOUSE OF REPRESENTATIVES; SENATE; Commerce, Dept of (DOC)

Bills named: S. 4207 (118th)

Taxation/Internal Revenue Code TAX

American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to the implementation of the CHIPS and Science Act (P.L. 117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act. United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024). Issues related to OECDs Pillar Two implementation. Semiconductor Technology Advancement and Research (STAR) Act (H.R. 9183).

Contacted: SENATE; HOUSE OF REPRESENTATIVES

Bills named: S. 866 (118th), H.R. 9183 (118th), H.R. 2673 (118th), H.R. 7024 (118th), H.R. 4729 (118th), S. 3084 (118th), S. 1457 (118th), H.R. 5988 (118th)

Labor Issues/Antitrust/Workplace LBR

Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167). Bipartisan Workforce Pell Act (H.R. 6585). A Stronger Workforce for America Act (H.R. 6655). Labor Certification for Permanent Employment of Foreign Workers in the United States; Modernizing Schedule A To Include Consideration of Additional Occupations in Science, Technology, Engineering, and Mathematics (STEM) and Non-STEM Occupations, Reauthorization of the Workforce Innovation and Opportunity Act (WIOA).Efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.

Contacted: HOUSE OF REPRESENTATIVES; White House Office; SENATE; Natl Science Foundation (NSF); Labor, Dept of (DOL); Commerce, Dept of (DOC)

Bills named: H.R. 6655 (118th), H.R. 6585 (118th)