SEMICONDUCTOR INDUSTRY ASSOCIATION for SEMICONDUCTOR INDUSTRY ASSOCIATION

Immigration IMM

Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration; including proposed rules on fees.

Contacted: HOUSE OF REPRESENTATIVES; Executive Office of the President (EOP); SENATE

Budget/Appropriations BUD

Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: HOUSE OF REPRESENTATIVES; Defense, Dept of (DOD); Energy, Dept of; Natl Institute of Standards & Technology (NIST); Natl Science Foundation (NSF); SENATE; Executive Office of the President (EOP)

Trade (domestic/foreign) TRD

Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.

Contacted: U.S. Customs & Border Protection; State, Dept of (DOS); Natl Security Council (NSC); U.S. Trade Representative (USTR); Natl Economic Council (NEC); Defense, Dept of (DOD); HOUSE OF REPRESENTATIVES; SENATE; Treasury, Dept of; Executive Office of the President (EOP); White House Office; Commerce, Dept of (DOC)

Defense DEF

Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (export control, outbound investment, NEPA, other).

Contacted: Executive Office of the President (EOP); Natl Security Council (NSC); HOUSE OF REPRESENTATIVES; Commerce, Dept of (DOC); White House Office; SENATE; Defense, Dept of (DOD); State, Dept of (DOS); Homeland Security, Dept of (DHS)

Environment/Superfund ENV

American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA.

Contacted: Environmental Protection Agency (EPA); White House Office; HOUSE OF REPRESENTATIVES; General Services Administration (GSA); Executive Office of the President (EOP); Bureau of Land Management (BLM); SENATE

Science/Technology SCI

Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).

Contacted: Executive Office of the President (EOP); Natl Institute of Standards & Technology (NIST); Defense Advanced Research Projects Agency (DARPA); Office of Science & Technology Policy (OSTP); SENATE; Energy, Dept of; Natl Science Foundation (NSF); HOUSE OF REPRESENTATIVES; Defense, Dept of (DOD)

Telecommunications TEC

Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).

Contacted: Commerce, Dept of (DOC); HOUSE OF REPRESENTATIVES; SENATE

Taxation/Internal Revenue Code TAX

American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities, Taiwan tax agreement.

Contacted: SENATE; HOUSE OF REPRESENTATIVES

Bills named: H.R. 2673 (118th), S. 866 (118th)

Labor Issues/Antitrust/Workplace LBR

Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).

Contacted: Commerce, Dept of (DOC); White House Office; SENATE; HOUSE OF REPRESENTATIVES