ENTEGRIS for ENTEGRIS
What was lobbied
3 issue areas, each in the filer's own words, with who lobbied on it and where.
Telecommunications TEC
Discuss and monitor issues related to semiconductor equipment, materials and solutions manufacturing, including implementation of the CHIPS and Science Act (P.L. 117-167); HR 4549 / S. 2228, Building Chips in America Act of 2024 (Discuss and monitor issues related to implementation of CHIPS and Science Act environmental permitting requirements); HR 2670 / S. 2226, National Defense Authorization Act for Fiscal Year 2024 (Discuss and monitor issues related to implementation of environmental review requirements for large government projects).
| Lobbyist | Covered position, as disclosed |
|---|---|
| BRIAN EAGLE | — |
Taxation/Internal Revenue Code TAX
Discuss and monitor issues related to semiconductor equipment, materials and solutions manufacturing, including implementation of Advanced Manufacturing Investment Credit within the CHIPS and Science Act (P.L. 117-167); HR 4729 / S. 1457, Taiwan Tax Agreement Act of 2024 (monitor and discuss issues related to tax status of corporations operating in Taiwan and the United States); US-Taiwan Expedited Double Tax Relief Act (monitor and discuss issues related to tax status of corporations operating in Taiwan and the United States).
| Lobbyist | Covered position, as disclosed |
|---|---|
| BRIAN EAGLE | — |
Trade (domestic/foreign) TRD
HR 2670 / S. 2226, National Defense Authorization Act for Fiscal Year 2024 (Monitor and discuss issues related to screening of outbound investments).
| Lobbyist | Covered position, as disclosed |
|---|---|
| BRIAN EAGLE | — |
Shown as published by the Senate Office of Public Records and the House Clerk under the Lobbying Disclosure Act. The official filing is the record; open it for the full form.